RFID Flip-chip Bonding Machine
Price: |
200000.0 USD |
Payment Terms: |
T/T |
Place of Origin: |
Hubei, China (Mainland) |
Product Detail
Model No.:
Hei-Diii
Production Capacity:
30Sets/Month
Delivery Date:
around 30 days
Automatic Grade:
Automatic
Usage:
Outer
Brand Name:
HIT
Means of Transport:
Ocean
Packing:
Wooden/metal box
Processing:
Labeling Machine
Type:
General
Packaging:
Paper
Specifications:
Adopts flip-chip bonding technology: pick the die chip from the wafer and bond it directly with the antenna then heat and press, the
Features:
Based on high-precision positioning technology such as the visual image processing guiding, high-speed trajectory-timing planning and closed-loop control of grating precision feedback, achieve to place microchip (minimum 0.3 x 0.3mm² chip) fast, precisely and cost effective
Via tension-positioning mixed control or distributed control, achieve to feed and place precisely in multiple amplitude and long-span flexible membrane matching the point-by-point positioning technology, could adapt domestically antenna substrate and make the antenna cost lower more than 50% than imported substrate
Use time pressure of non
Newtonian fluid dispensing process control technology to achieve the precise control of the amount of glue and save 30% of the cost compared with traditional dispensing process
Use the intermittent movement, the tact control technology of the optimized components to improve the stability of the system while reducing the overall energy consumption more than 60%
Applications:
It's applicable to various types of HF/UHF inlay packaging of the field applications, logistics management and traceability, merchants anti-counterfeiting and management, manufacturing logistics and monitor
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