High-end Equipments (Total 2 Products)

RFID Antenna Testing Machine

HEI-SI

Features:
Substrate transport module dispensing module flip chip module,final bonding module and detection module are integrated in HEI-SIand HEI-SI

2016-07-28

RFID Flip-chip Bonding Machine

Hei-Diii

Specifications:
Adopts flip-chip bonding technology: pick the die chip from the wafer and bond it directly with the antenna then heat and press, the

2016-07-28